Kemet International’s Contract Lapping Department has the capability to provide solutions to most Flat Lapping and Polishing applications. Our expertise is wide and varied and includes the lapping and polishing of Mechanical Seals, Automotive Components, Aerospace Parts, Medical Components, and Flat Injection Moulding Inserts to name but a few.

We can process most types of materials to a specific surface finish and flatness using combinations of Kemet Composite Lapping and Polishing Plates, Polishing Pads, Diamond Slurries, Diamond Suspensions and Lapping compounds. Matt lapped finishes can also be provided where required.

Our policy is to provide cost effective solutions, and turnaround times to suit customer deadlines, as we are always aware that lapping is often the last process of a components manufacture.

With extensive experience in process development and customer support, we have the knowledge to provide a complete lapping process for all your surface finishing needs. We offer a comprehensive selection diamond abrasives (diamond slurry, liquid diamond, diamond suspension, diamond paste and diamond compound) and conventional abrasive powders and lapping pastes (silicon carbide, aluminium oxide). We offer the widest range of lapping plates, flatness measuring equipment and polishing pads.

We have the knowledge and experience to offer you the correct lapping machine. Our lapping machines range from 380mm (15″) diameter to over 3.0m (36″).

Kemet Diamond Paste and Kemet Diamond Compound are supplied in various types of packaging sizes including 5g, 10g, 20g, 50g, 100g and 1kg containers. The unique Applikator ensures that accurate amounts of diamond compound are correctly dispensed with no leakage from the syringe.

Type KD diamond paste

• Universal diamond paste / diamond compound for stock removal and superfine surface finish.
• This diamond compound is soluble in both oil and water.
• Diamond compound recommended for Toolroom and Precision Engineering applications.
• Available from 1/10 micron to 90 micron
• Available in 5g Applikator, 10g syringe, 10g stick, 20g syringe and other sizes

• Oil Soluble diamond compound / paste specially developed for use on hard materials such as Tungsten Carbide, Hardened Steels and Ceramics.
• High thermal stability of the carrier ensures that Kemet Diamond Compound resists frictional heat, remains stable and keeps its suspension properties under operating conditions.
• Diamond compound recommended for Toolroom and General Production applications.
• Available from 1 micron to 90 micron
• 5g Applikator, 5g dip jar, 10g syringes and 20g syringes available